Compact Power. Unmatched Durability. Discover CuX Piezo Stacks
The piezosystem jena CuX series provides compact, high-efficiency multilayer piezo actuator stacks designed for demanding industrial and scientific applications. Engineered using advanced piezoceramic (PZT) materials, these stacks offer rapid response times, exceptional durability, and precise displacement across a wide range of voltages.
Key Features
- Higher Performance: With more optimized active areas, CuX stacks can achieve 20% greater strokes.
- Humidity Resistant and Cost-Effective: With copper-based design, CuX stacks are outstanding against humidity and better cost-effective solution.
- Higher Temperature Operation: Thanks to lead-free metal bond, CuX stacks are extremely durable at temperature range of 200°C without embrittlement.
- Longer Lifetime: CuX stacks have extended lifetime, tested up to 1 billion cycles with 83Hz and 170°C. Proven durability up to 95% humidity.
- Available in High Volume: CuX stacks are available in high-volume with short delivery times.
Download datasheet here.
Choosing CuX means more than just advanced piezo performance—it’s a smart business decision. With extended lifetime and outstanding durability, CuX stacks reduce replacement intervals and maintenance costs, resulting in a significantly lower total cost of ownership. Their copper-based design shields you from raw material price swings, ensuring consistent, reliable budgeting.
Need parts fast? CuX stacks are volume-ready with short delivery times for standard configurations, supporting accelerated development and reduced time-to-market. Their scalable production capability makes them ideal for OEMs and high-volume applications.
Typical Applications:
Precision mechanics and automation for semiconductor manufacturing: CuX stacks deliver up to 20% greater stroke and longer lifetime compared to conventional piezo stacks. Moreover, these stacks enable smaller assemblies for higher extension factor, which make them ideal for demanding semiconductor environments, such as wafer alignment, lithography and mask inspection processes.
High-end solutions for micro-dispensing valves: CuX stacks incorporate high-temperature stable bonding validated up to 200 °C and offer excellent resistance to humidity and aggressive media. CuX stacks ensure high repeatability and long-term reliability in micro-dosing and jetting applications, even under harsh process conditions.
Aerospace and optical systems: CuX stacks provide fast sub-millisecond response with higher stiffness, which is ideal for fine optical adjustments, active stabilization, and lightweight aerospace systems where reliability, compactness, and performance are highly critical.
Microfluidics and dosing control: High dynamic range, precise displacement control and low hysteresis enable accurate dosing of small volumes in analytical instruments and lab-on-chip platforms. CuX actuators can perform repeatable microfluidic control under fluctuating temperature and loads.
Active vibration and noise control: With their high force density and long cycle life, CuX actuators are well-suited for real-time vibration damping in precision equipment and vehicles. Their rapid actuation and robust construction support consistent performance in dynamic and high-frequency environments.
Why CuX Outperforms Traditional Piezo Stacks:
Optimized Active Area for Enhanced Performance and Longevity
Mechanical stress during operation is often concentrated in the inactive regions of a piezo actuator. These zones are prone to initiating cracks in the ceramic structure, especially as their size increases. CuX stacks significantly reduce this risk by minimizing inactive layer width to just 100 µm—a fourfold improvement over conventional designs (typically ∼400 µm). This refinement not only lowers internal stress but also extends actuator life, enables higher operating voltages (up to 180 V), and delivers approximately 20% greater stroke which peak their actuating performance.
Copper Inner Electrodes: Humidity-Resistant and Economically Efficient
Key Notes
- Copper-based inner electrodes for:
- Avoiding Ag migration between the inner electrodes
- Tested up to 1 billion cycles of 83 Hz and 170°C
- Outstanding resistance against humidity
- Cost-saving in further moisture protection
Standard multilayer actuators often use silver-palladium alloys for internal electrodes, but silver is highly prone to migration under humid conditions and electric fields which leads to internal short circuits or failure. CuX stacks avoid this issue by employing copper electrodes, which offer excellent resistance to ion migration and maintain electrical integrity even in harsh environments. Copper is not only mechanically stable, but also significantly more cost-stable compared to palladium. Hence, making CuX stacks a smart choice for both reliability and cost-efficiency.
Lead-Free High-Temperature Metal Bonding for Maximum Durability
The joints that connect external electrodes endure substantial mechanical and thermal stress during extended operation. Traditional lead-based solders often fail at elevated temperatures due to embrittlement. CuX stacks incorporate a lead-free, high-melting-point metallic bond that remains structurally sound and flexible under extreme thermal conditions. This advanced interconnection technology has been validated through endurance testing, maintaining full functionality after 2000 hours at 200 °C, whereas conventional solders typically fail after just 1500 hours at 180 °C. The result is superior thermal reliability without compromising environmental safety.
