Eitzenberger Multi-Axis Stages

Eitzenberger EZ-0117 XY-Stage

In the design of the Eitzenberger EZ-0117 XY-Stage, particular emphasis was placed on a cost-conscious design combined with high accuracy requirements. The treads for the air bearings are covered with bellows to prevent the ingress of particles, making the EZ-0117 particularly suitable for particle-loaded applications.
Eitzenberger EZ-0714 XY-Gantry Stage

The Eitzenberger EZ-0714 XY-Gantry Stage is designed for positioning tasks with high accuracy requirements, making it particularly versatile in use. Due to the optional equipment with bellows, the stage is suitable for particle-laden processes as well as for laser machining processes. The coplanar arrangement of the axes and the gantry design ensure very high repeatability and positioning accuracy.
Eitzenberger EZ-0715 High Precision Gantry

The Eitzenberger EZ-0715 High Precision Gantry is designed for high precision applications. Incremental measuring systems (Heidenhain LIP6 G0) and an optimized design allow a positioning accuracy of ± 250 nm and a repeatability of ± 25 nm for the single axes.
Eitzenberger EZ-0730 High Precision Impulse Decoupled Stage

Intelligent design gives the Eitzenberger EZ-0730 High Precision Impulse Decoupled Stage maximum rigidity and excellent repeatability, minimizing axis crosstalk.
Eitzenberger EZ-0745 ZC-Axis

The Eitzenberger EZ-0745 air- bearing ZC-Axis is intended for integration into an XY-stage (e.g. EZ-0715). Due to the highly integrated design, only a low overall height of approx. 138 mm is required.
Eitzenberger EZ-4360 ZC-Motion System

The Eitzenberger EZ-4360 ZC-Motion System was developed as kinematics for measuring rotationally symmetrical components. The test object is positioned and rotated on a rotary table while the measuring head is moved vertically via a high-precision air-bearing axis.
Eitzenberger EZ-GS0760 Dynamic Wafer Stage

The Eitzenberger EZ-GS0760 wafer stage has been developed for high-dynamic processes, such as laser fuse cutting. It offers excellent repeatability, optimal accuracy, and exceptional dynamic performance.
Eitzenberger's Dynamic Wafer Stage: Increased dynamics with double pulse decoupling

Eitzenberger’s Dynamic Waferstage with dual impulse decoupling is featured in the latest issue of the industry magazine microProduction. This innovative development significantly enhances both dynamics and precision in laser micromachining.
Eitzenberger: EZ-8046 Frictionless Self-Aligning Precision for Assembly Processes

Eitzenberger introduces the new EZ-8046 Self-Aligning Unit, a compact aerostatic spherical air bearing designed for ultra-precise alignment and positioning applications. By combining frictionless air bearing technology with a spherical design, the system enables passive self-alignment in three degrees of freedom and achieves contact surface parallelism of less than 2 µm.