Eitzenberger’s Dynamic Waferstage with dual impulse decoupling is featured in the latest issue of the industry magazine microProduction. This innovative development significantly enhances both dynamics and precision in laser micromachining.
With a fully impulse-decoupled, air-bearing positioning system, the Dynamic Waferstage minimizes unwanted vibrations while boosting travel speed and process stability — setting new standards in high-performance motion systems.
The result:
- Improved beam positioning on the wafer plane
- Higher process reliability in complex laser trimming applications
- Optimized machining quality at maximum dynamics
The article also explores how this technology is being applied in high-precision manufacturing — for example, in 3D-Micromac AG’s microVEGA FC systems for link trimming.