The Helmut Fischer FISCHERSCOPE® XDV®-μ spectrometers are Fischer’s high-end X-ray fluorescence (XRF) series, developed for precise layer thickness measurement and material analysis on the tiniest of structures. All units are equipped with a polycapillary optics that focuses the X-ray beam to 10 μm (FWHM). The polycapillary optics produces a high radiation intensity, which drastically reduces the measuring time compared to an optics with collimator. 

All Fischer XRF instruments are supplied with the versatile WinFTM software, which allows you to measure a wide range of applications with superior accuracy. WinFTM also has an integrated report generation tool that allows you to create individual reports with just one click. In addition, the WinFTM software offers guided calibration. 

The XDV-μ devices work with a range of filters as well as voltage and current settings that allow you to create the best excitation conditions for complex applications with up to 24 elements. In addition, the XDV-μ has a programmable XY stage and pattern recognition software to make automated measurements on multiple samples as easy as possible. 

In the standard version, the XDV-μ is equipped with a tungsten X-ray tube for high precision in general applications. Molybdenum and chrome variants are also available.

Features:

• Simultaneous measurement of up to 24 elements, from Al(13) to U(92), XDV-μ LD: S(16)-U(92)
• Advanced polycapillary optics that focuses the X-ray beam down to 10 μm (FWHM) for measuring on microstructures
• Programmable XY stage and pattern recognition for automatic measurements on multiple samples
• Extending sample stage for easy positioning of the sample
• Guided calibration process
• Robust design for long-term use
• Optical microscope (270x magnification) with video, laser pointer to show the exact measuring spot
• Fundamental parameter analysis for measurements without calibration
• Complies with IPC-4552A, 4553B, 4554 and 4556, ASTM B568, ISO 3497
• Fischer's certified standards are traceable to internationally recognized base units

Applications:

• Au/Pd/Ni/CuFe and Sn/Ni coatings in the micro- and nanometer range
• Assembled and unassembled circuit boards
• Testing of base metallization layers (under-bump metallization, UBM) in the nanometer range
• Measurement of light elements, e.g. determination of the phosphorus content (in ENEIG/ENEPIG) under Au and Pd
• Lead-free solder caps on copper pillars
• Testing the elemental composition of C4 and smaller solder bumps, as well as small contact surfaces in the semiconductor industry