Wafer inspection using digital holography microscopy: Digital holography enables fast and stable 3D topography acquisition. It is ideal for wafer level inspection. Structure height, flatness, defect are measurable at unrivalled speed.
Lyncée Tec announce an innovative Lens-less sensor, capable of scanning a full wafer in 60 seconds ! Compact new design, easy to integrate, customizable UI! Fastest 3D profilometer ever build!