LaVision StrainMaster

LaVision StrainMaster

StrainMaster from LaVision is a state-of-the-art, non-intrusive optical tool for shape, strain and deformation analysis of solid and granular subjects. StrainMaster combines the most advanced Digital Image Correlation (DIC)algorithms with the highest quality of hardware to provide a complete and easy to use instrument for materials analysis. A range of StrainMaster systems are available from portable field work systems to highly specialized lab versions.

Get a comprehensive overview about LaVision's StrainMaster DIC System capabilities

The LaVisionStrainMastersystem family consists of state-of-the-art optical measuring instruments for shape, strain and deformation analysis.

LaVision Small Scale Micro-DIC Systems

Understanding the mechanical and material behavior of microscale components is extremely challenging and there is often a lack of detailed information on microelectronic or biomedical materials in terms of stress-strain behavior. LaVision offers stereo microscope based 3D DIC systems with special optical calibration models which allow the user to collect and analyze full field shape and strain in sub millimeter ranges. This information is extremely valuable in validating complex Finite Element simulations.

LaVision StrainMaster Compact

The LaVisionStrainMaster Compact is a compact, pre-configured system for optical deformation and fracture analysis. The system works according to the digital image correlation (DIC) method and consists of two cameras and an integrated LED illumination source in a handy measuring head.

LaVision StrainMaster Portable

StrainMaster Systems

LaVision’s StrainMaster systems provide turnkey imaging solutions for various materials testing applications. The systems include all necessary components: high resolution digital cameras, illumination units, synchronization electronics, mounting mechanics and software for recording and DIC computation.