3D-Micromac’s microSHAPE laser system is specifically designed to process large and flat substrates with high accuracy. Furthermore, this highly versatile system facilitates the integration of different laser processes in a single machine. Additionally, it boasts the capability of utilizing multiple working heads; as a result, this parallel processing enhances throughput, making higher production rates possible.

Moreover, microSHAPE is a well-established solution in the industry for various ablative and non-ablative processes. These processes encompass cutting, the selective removal of thin films, and structuring techniques such as engraving and marking. Consequently, the microSHAPE system is adept at handling a diverse array of materials, including glass, metals, polymers, ceramics, display stacks, and coated substrates.

Image: microSHAPE processing

Highlights

• Free form cutting with extraordinary quality
• Damage free cutting edges
• Contactless processing enables minimal cost of ownership
• Cutting speed up to 1.5 m/sec
• Laser sources according to customer requirements
• Up to 3 independent beam paths

The microSHAPE platform is based on a gantry design that can easily be configured in dynamics, metrology, handling, and laser and beam delivery components. The system can be scaled in size and accuracy according to the process’s requirements.

This results in a highly productive laser system dedicated to its target applications which include ablative processes like engraving and marking as well as cutting, and selective removal of thin films.

The availability of several handling and inspection options enables the system to be used as a highly efficient production platform. It can be easily integrated into production lines. Robotic or manual loading and unloading options are available as well.

Suited for:

• Separation (filamentation & cleaving)
• Structuring
• Half and full cut
• Engraving and marking

Download datasheet here.