3D-Micromac's microCELL production solutions, such as high performance laser processing for Laser Contact Opening (LCO) of high efficient PERC solar cells as well as laser dicing of full cells into half cells with Thermal Laser Separation (TLS-Dicing), have been designed to meet cell manufacturers‘ demands for achieving maximum throughput rates and yield while diminishing cell manufacturing costs.

NEW: microCELL™ MCS
The advanced microCELL MCS laser cutting system has been developed to meet the photovoltaic (PV) market’s demands for boosting module power output and service life by minimizing power losses and providing for an exceptionally high mechanical strength of cut cells. It provides a free choice of cell-cutting layouts that range from half to shingled without compromising throughput or yield.

Based on the proven TLS-Technology, which enables unmatched edge quality in solar cell cutting, the future-proof microCELL MCS fits into an intelligent, scalable production system with minimized efforts on upgrading by adding functionalities.

microCELL™ TLS
3D-Micromac‘s microCELL TLS is a highly productive laser system for the separation of standard silicon solar cells into half cells. The microCELL TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells for improved module reliability and less power degradation over the whole module lifetime.

The ablation-free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full-scale manufacturing of crystalline half cells.

microCELL™ OTF
3D-Micromac‘s microCELL OTF meets cell manufacturers‘ demands for increasing the efficiency of PERC solar cells, by precise surface structuring, low operating costs, and highest availability. The system is suitable to process mono- and polycrystalline silicon solar cells.
Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The contactless cell handling enables processing without surface defects or microcracks.

The microCELL MCS system offers half- and shingled-cell cutting for improved module performance. The TLS-Technology has gained importance in contrast to conventional separation techniques due to smooth and defect-free cutting edges. This leads to a significantly higher module power gain and less module power degradation.

• No crystal damage (displacement of resolidified silicon) at the cutting edge
• No discharge and no particle formation, as the substrate is only heated and not vaporized
• Higher mechanical stability of processed solar cells
• Routine leaves no residues
• 2D surface (rather 3D topography) causes less recombination and ability for passivation

Download datasheet here.