3D-Micromac‘s microPRO is an adaptable laser micromachining system mainly used in industrial production. Its high versatility makes the system perfectly suited for industrial laser micromachining tasks such as laser structuring, cutting, and drilling applications. Furthermore, it is suitable for a variety of materials, e.g. metals, alloys, transparent and biological subtrates, ceramics, and thin-film compound systems. The microPRO is available with an automatic handling system for wafers, cassettes, trays, etc.
Configuration packages
The microPRO enables the laser processing of various substrates. Due to the integration of different technology modules, the platform can be adapted to customers’ requirements.
Configuration packages may include:
- High-speed cutting
- Drilling
- Engraving
- Structuring and modification
- Laser-Lift-Off (LLO)
- Cylindrical machining
- Customized solutions
Highlights
- Flexible, stable, and repeatable machining results
- Integration of different laser sources
- Various optical setups
- Quick changing of workpiece clamping unit
- User-friendly, flexible, upgradeable system control and high range of software functions
- Automatic handling systems for industrial applications on request
Download datasheet here.
