ToupTek Photonics  SWIR Machine Vision cameras are imaging capture devices which use USB3.0 / GigE to transmit uncompressed images in real time. They support image acquisition and parameter setting (such as working mode, image parameter adjustment etc.) through client-side user-friendly software.

Features:

  • Sony Exmor back-illuminated CMOS sensor;
  • Two-step noise reduction technology;
  • Ultra-high sensitivity and low noise;
  • USB3.0(compatible with USB2.0 protocol) / GigE data transmission interface ;
  • Provides advanced video and image processing application software ToupView, compatible with Windows/Linux/OSX multi-platform SDK, support native C/C++, C#/VB.Net, DirectShow, Twain API;
  • Supports external triggering, digital I/O and free-running modes;
  • Supports ROI, flip, bit-depth switching and other features;

Machine Vision Camera User Manual

 

Models available:

SWIR(Short-Wavelength Infrared) series are TE-Cooling USB3.0 / GigE InGaAs cameras;

  • IUX series is USB3.0 interface cameras for industrial applications. It includes IUA,IUB and IUC.
  • IUA is mainly for the 1/2.8”~1.1”sensor;
  • IUB is mainly for the GSENSE sensor with sensor size 1/1.1”~1.7”;
  • IUC is for the APS and full frame sensor(2.7”);
  • I3ISPM series is USB3.0 interface color camera for industrial applications, having built-in hardware ISP to ensure color reproduction and higher video speed. The resolution coverage is from 0.5MP to 20MP.
  • I3CMOS series is USB3.0 interface monochrome camera for industrial applications. The resolution coverage is from 0.5MP to 20MP.
  • KMA means black/white camera and KPA means color camera which having built-in hardware ISP to ensure color reproduction and higher video speed. The resolution coverage is from 1.7MP to 43MP.

Specifications:

SWIR series camera specifications (SWIR, 4)

Order Code Sensor & Size(mm) Pixel(μm) G Sensitivity
Dark Signal
Interface FPS/Resolution Binning Exposure
SWIR1300KMA 1.3M/IMX990(M,GS)
1/2”(6.40x5.12)
Buit-in TEC
5x5 121mV with 1/30s
1.0mV with 1/30s
USB3 200@1280x1024
392@640x512
1x1
1x1
15us~60s
SWIR1300KMB 1.3M/IMX990(M,GS)
1/2”(6.40x5.12)
External TEC
5x5 121mV with 1/30s
1.0mV with 1/30s
USB3 200@1280x1024
392@640x512
1x1
1x1
15us ~60s
SWIR330KMA 0.33M/IMX991(M,GS)
1/4”(3.20x2.56)
Buit-in TEC
5x5 121mV with 1/30s
1.0mV with 1/30s
USB3 400@640x512
753@320x256
1x1
1x1
15us~60s
SWIR330KMB 0.33M/IMX991(M,GS)
1/4”(3.20x2.56)
External TEC
5x5 121mV with 1/30s
1.0mV with 1/30s
USB3 400@640x512
753@320x256
1x1
1x1
15us~60s
SWIR1300KMA-G 1.3M/IMX990(M,GS)
1/2”(6.40x5.12)
Buit-in TEC
5x5 121mV with 1/30s
1.0mV with 1/30s
GigE 90@1280x1024
253@640x512
1x1
1x1
15us~60s
SWIR1300KMB-G 1.3M/IMX990(M,GS)
1/2”(6.40x5.12)
External TEC
5x5 121mV with 1/30s
1.0mV with 1/30s
GigE 90@1280x1024
253@640x512
1x1
1x1
15us~60s
SWIR330KMA-G 0.33M/IMX991(M,GS)
1/4”(3.20x2.56)
Buit-in TEC
5x5 121mV with 1/30s
1.0mV with 1/30s
GigE 258.8@640x512
486.1@320x256
1x1
1x1
15us~60s
SWIR330KMB-G 0.33M/IMX991(M,GS)
1/4”(3.20x2.56)
External TEC
5x5 121mV with 1/30s
1.0mV with 1/30s
GigE 258.8@640x512
486.1@320x256
1x1
1x1
15us~60s